Chemical Mechanical Planarization (CMP) is a polishing technology used in semiconductor manufacturing to produce high-precision wafers.
It combines chemical corrosion and mechanical action to planarize silicon wafers or other substrate materials during processing.

CMP slurry plays a critical role in the formation of multi-layer semiconductor circuits. However, due to chemical instability and process conditions, gels and agglomerates may form in the slurry. Large particles can be transported to the wafer surface, causing defects such as micro-scratches and significantly reducing yield.

Therefore, effective filtration in CMP processes is essential to remove oversized particles and agglomerates without affecting polishing performance. 

Station

① Coarse Filtration

• MicroPure Classic Series PP Melt Blown Filter Cartridge
• AquaPure Series String Wound Filter Cartridge

② Fine Filtration

• CMPro-L Series High Flow PP Depth Filter Cartridge

③ Terminal Filtration

• PoliCap Terminal (POU) Compact Capsule Filter for CMP
• PoliCap-Plus Terminal (POU) Slurry Capsule Filter for CMP Terminal

For detailed technical solutions and product series information, please contact Henan Clande Filter Technology Co., Ltd. sales engineers.